Follow Us on LinkedIn Follow Us on YouTube

  1. CLC 15-150 A/B

    A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling endurance. Product meets UL 94-HB flammability requirements. CLC 15-150 A/B

  2. CLR 1020 / CLH 6021

    Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

  3. CLR 1026 / CLH 6021

    Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

  4. CLR 1066 / CLH 6520

    Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

  5. CLR 1157 / CLH 5515

    Heat Cure Semi-Rigid Epoxy Transformer Casting System. Increased flexibility when compared to CLR 1331 / CLH 5515 family. System exhibits excellent thermal stability and thermal cycling performance. A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. Product meets UL94-HB flammability requirements. CLR 1157 / CLH 5515

  6. CLR 1180 / CLH 6520

    Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520

  7. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  8. CLR 1205 / CLH 6770

    Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

  9. CLR 1556 / CLH 6510

    Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6510

  10. CLR 1556 / CLH 6520

    Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6520

  11. CLR 1556 / CLH 6640

    Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640

  12. CLR 1710 / CLH 6710

    Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710

  13. CLR 1946 / CLH 6500

    Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500

  14. CLR 3507 / CLH 6230

    A semi-flexible, 100% solid, epoxy system. This product was specifically developed for potting / casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. Product passes UL94-HB in-house flammability testing. For a more rigid system, CLR 3517 / CLH 6230 is recommended. CLR 3507 / CLH 6230

  15. CLS 9611

    A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611

  16. CLS 9616

    Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616

  17. XID 1681 / XHD 1652

    A two component polyurethane casting system. Product has long pot-life and cures to a hardness of 65 Shore D. XID 1681 / XHD 1652

  18. XPD 1401 / CLI 4182

    Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182

  19. XRD 1018 / XHD 1019

    1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019

  20. XRD 1575 / XH 61418

    2:1 machine dispense adhesive. Bonding abrasive wheels and disks. A two component epoxy system suitable for potting, casting and adhesive applications. Product gels quickly and has good thermal cycling endurance. Material is filled with non-abrasive fillers making it suitable for machine dispensing. XRD 1575 / XH6 1418

Results 1 - 20 of 20

Filters